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Los Alamos National LaboratoryCenter for Integrated Nanotechnologies
Helping you understand, create, and characterize nanomaterials
DOE

Tool Sets

Learn more about specific tools sets in CINT Integration Lab

Integration Lab layout and available tool sets

To gain entry to the Integration Lab, you must complete the Training Requirements

Click on a subject below to learn more about the specific tool set.

photoDeposition

photoPlasma

photoE-beam Writer

photoScanning Electron Microscope (SEM)

photoLithography

photoWet Benches

photoMetrology

integration lab map

Deposition

The deposition area comprises of thin film deposition tool and annealing systems. The systems in this area are as follows:

Tool typeTool name

HV metal deposition (e-beam and thermal)

EG 1 and 2

Rapid thermal annealing

RTA

Tube furnace

TUBE6

Wafer lapper

LAP

Wafer dicing

DICE

To access the Facilities User Guide (FUG) for the Deposition Functional group please refer to the training page.

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E-beam Writer

  • Scanning Electron Microscope
  • E-Beam Writing

Lithography

  • Spinner Bench
  • Solvent Bench
  • Base Bench
  • Hot Plates
  • Ovens
  • OAI Mask Aligner
  • MJB-3 Mask Aligner
  • LFE-DESCUM

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Metrology

  • Profilometer
  • Ellipseometer
  • Confocal Scope
  • Flexus
  • FPP (Presently trying to discover the real name for the tool)
  • Nanospec

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Plasma

  • Trion ICP RIE
  • Trion ICP Fluorine
  • Trion ICP CVD
  • Oxford Etcher
  • Bosch etcher
  • Batchtop RIE
  • Batchtop O2 plasma

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Scanning Electron Microscope

  • Scanning Electron Microscope
  • Focused Ion Beam
  • EDAX

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Wet Benches

  • Acid Bench
  • Base Bench
  • Solvent Bench
  • Plating Benches

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