Mechanical support allows for high-density films (e.g. low imperfections) without significant stresses. For micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS), the ability to tailor the stress is key as stress and stress gradients are dominant, device failure-inducing mechanisms.

Capabilities include:

• Deposition of high-quality low-stress films including LPCVD SiN, thermal SiO₂, LPCVD SiO₂, and LPCVD Poly-Si layers for electrical isolation and mechanical support. 

Contact: John Nogan