BEOL/Assembly Capabilities

• BOND1 (EVG501 — Room 1530)
  • Highly versatile wafer bonding system that handles substrate sizes from small chips to 150 mm. Supports common wafer bonding processes such as anodic, glass frit, eutectic, transient liquid phase, and direct. Thermal, compression, anodic up to 100 kN, 550 °C, vacuum 1E-6 Torr. In start-up 03/2022.

• DICE 1/ DICE 2 (Microautomation — Room 1511)

  • Programmable automatic dicing saw with split video optics. Accommodates substrates to 150 mm in diameter. Air-bearing spindle with an adjustable speed from 10,000 to 30,000 rpm. Precision better than 5-micron maximum deviation.

• Dicing Saw 7122 ADT (ADT 7122 – Room 1511)
  • Programmable automatic dicing saw with 17” touch screen monitor.
  • Can accommodate substrates to 200 mm in diameter, CO2 injection to prevent particle adhesion (resist free dicing) and to protect ESD sensitive devices.
  • Air bearing spindle with an adjustable speed up to 60,000 rpm.
  • Materials supported include silicon, glass, common III-V semiconductors, alumina and sapphire

• Lap/Polish Allied MultiPrep 8 (Allied TechPrep – Room 1511)
  • Basic polishing system with 8” platen. 

• Lap/Polish Allied MultiPrep 12 (Allied MultPrep Room 1511)
  • Precision polishing system with 12” platen and parallel polishing fixture.
  • Dual axis, micrometer controlled angular positioning of the sample, (pitch and roll) +10/–2.5° range, 0.02 ° increments.

  • Adjustable sample load from 0–600 grams, in 100 gram increments.

• MR200 Micro diamond Scriber (OEG MR-200 – Room 1511)

  • Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers and a variety of III-V materials.

• Ultron System Model UH114 tape mounter 1 (Room 1511)
  • Ultron Systems UH114 tape mounter for dicing applications.

Contact: Tzu-Ming Lu

1. User provides the accepted user project number and list of desired tools to be accessed to the IL Manager.

2. The IL Manager will send a list of the required corporate-mandated classes to the user and notify the training coordinator of the student's needs. These classes must be completed prior to getting unescorted access to the IL.

3. The user completes all of the assigned corporate-mandated training classes.

4. User provides proof of training, i.e. date of completion, to the IL Manager.

5. User reads/signs facility users guides (FUGs) for the required IL functional groups.

6. User receives lab specific training from IL Personnel.

7. The lead process engineer submits a badge request to IL Manager for the user.

8. The training coordinator is notified by IL Manager to program the card reader to allow badge swipe access.

9. User receives equipment specific training from an authorized user. This training does not have to include all of the equipment in the IL, only what's needed by the user to complete the desired task. Subsequent training to follow as needed.

10. User demonstrates proficient operation of the tool to the tool owner. This occurs on an as-needed basis.

11. User is free to work unsupervised; however the buddy system may still apply depending on the operation and task.