Helping you understand, create, and characterize nanomaterials
Integration Lab
CINT INTEGRATION LAB — METROLOGY
Metrology Capabilities
Scanning Electron Microscope #1 (FEI NNL650 — Room 1504)
High resolution (20 nm) SEM, FIB, EDAX with integrated Omniprobe micromanipulator. System also equipped with a Nano Pattern Generating System (NPGS) to support small field electron beam lithography.
Scanning Electron Microscope #2 (FEI NNS450 — Room 1504)
High resolution (20 nm) SEM with integrated Nano Pattern Generating System (NPGS) to support small field electron beam lithography.
Profilometer 1 (Ambios XP-2 — Room 1530)
High resolution stylus-type surface profilometer with integrated 40–160x magnification and 1–4mm field of view. Maximum vertical range 400 microns, resolution 1 angstrom at 10-microns, 15 angstroms at 100-microns, and 62 angstrom at 400-microns. Repeatability 10-angstroms or 0.1% of nominal step. User definable downward force 0.8 mg–10 mg, 2-micron stylus.
Profilometer 2(KLA-Tencore AS-500 — Room 1523)
High resolution stylus-type surface profilometer, 5-micron stylus.
Flex 1 (KLA-Tencore F2320 — Room 1532)
Dual wavelength thin film stress measurement from room temperature to 500°C hotplate. Accommodates up to a 150 mm sample size. Samples analyzed in an Argon or Nitrogen environment. Evaluate the effects of temperature or time on a thin film’s stress characteristics.
Nano 1 (Nanometrics NanoSpec/AFT 210 — Room 1532)
Spectroscopic reflectometer film thickness monitor for precision measurement of single layer films such as silicon nitride, silicon dioxide, photoresist and a variety of polymers. Thickness range 100–50,000 Å. Stage can accommodate a variety of sample sizes up to at least 150 mm.
Nano 2 (Filmetrics F50-UV — Room 1523)
Spectroscopic reflectometer film thickness monitor for precision measurement of thin films such as silicon nitride, silicon dioxide, photoresist and a variety of polymers. Thickness range 5 nm–40 um (λ = 200–1100 nm). Stage accommodates sample sizes to 100 mm diameter and up to 115 points, 3D modeling, limited multilayer measurement capabilities.
Microscope 1 (Leica DM4000M — Room 1523)
Dark field, bright field, fluorescence and DIC modes, x5 to x150 power objectives. X and Y axis distance measurement to approximately 1-micron resolution.
Combines the capabilities of an optical microscope, scanning electron microscope and roughness gauge into a single system. Provides non-contact profile, roughness and thickness measurements on nearly any material. 658 nm laser, up to 19,200x mag, highly versatile.
Semi-automated sheet resistance measurement system utilizing Jandel 4pt probes, with temperature compensation. Probe types available:
Probe Type B — Conductive films greater than 125 nm thick and highly doped semiconductors.
Probe Type C — Medium dose implant @1000 Ω/sq.
Probe Type D/70 — Low dose or shallow implant. Thin metals <125 nm.
SFS1 (KLA/Tencore SS4500 — Room 1530)
Surface defect analysis and mapping tool. 0.5 um lower limit up to 100 mm diameter substrate, key instrument for troubleshooting micro contamination issues in other lab processing equipment.
Once your user project has been accepted, follow these steps to request access to the CINT Integration Laboratory (IL).
User provides accepted user project number and list of desired tools to be accessed to the IL manager, John Nogan.
The IL manager will send a list of the required corporate mandated classes to the user and notify the training coordinator of the student's needs. These classes must be completed prior to getting unescorted access to the IL.
The user completes all of the assigned corporate mandated training classes.
User provides proof of training, i.e. date of completion, to the IL manager.
User reads/signs facility users guides (FUG’s) for the required IL functional groups.
User receives lab specific training from IL Personnel.
The lead process engineer submits a badge request to IL manager for the user. The training coordinator is notified by IL manager to program the card reader to allow badge swipe access.
User receives equipment specific training from an authorized user. This training does not have to include all of the equipment in the IL, only what's needed by the user to complete the desired task. Subsequent training to follow as needed.
User demonstrates proficient operation of the tool to the tool owner. This occurs on an as-needed basis.
User is free to work unsupervised, however the buddy system may still apply depending on the operation and task.
