Our 100 mm facility has an exceptional tool set, which accommodates a wide range of substrates, films, and chemicals. We work closely with other centers and laboratories to integrate unique materials or processes into prototype micro/nano systems.

Fabrication Capabilities include:

• Front/backside contact mask photo-lithography (260 nm DUV, 365/400 nm NUV).
• Contact mask design and fabrication (0.6 um resolution, 4", 5", or 7" mask plates).
• PVD Metal/Dielectric deposition (E-beam/thermal evaporation, RF/DC Sputter).
• Dielectric thin film deposition (ICP, CVD, Si₃N₄, SiO₂, SiON).
• Reactive ion etching with laser endpoint detection (ICP and RIE fluorine, ICP chlorine, silicon deep RIE).
• Downstream low frequency source plasma ash.
• Plasma and UV/ozone cleaning.
• Atomic layer deposition, plasma and thermal
• Low pressure chemical vapor deposition (ST-SiN, LS-SiN, SiO2, a-Si and PolySi)
• Ion beam etch and sputter deposition (Single Source/Target, Non-Reactive)
• ATM/Vacuum oven, low temperature pulsed vapor oxidation, anneal, dry oxidation
• Wet chemistries.
• Wafer dicing and lapping.
• Focused ion beam.
• Electron beam lithography.
• Laser beam direct write.
• In-Situ SEM mechanical nanoprobe.
• Critical Point Dryer.

Inspection Capabilities include:

• SEM / EDAX.
• Pd/Au PVD for sample preparation.
• Optical microscope.
• Confocal microscope.
• Profilometer.
• Probe-station.
• Flexus stress measurement.
• Ellipsometer.
• Spectroscopic reflectometer.
• Four-point resistivity probe.