Housed in our Integration Lab, this state-of-the-art atomic layer deposition (ALD) system utilizes precursor gases with single atomic layer control to enable conformal coating for nanoscale structure integration.

The unique isolation chimney prevents cross-contamination of target materials and allows deposition profiles to be fine-tuned, affording sequential deposition of a series of metals (2–4) in single runs (without breaking vacuum).

Capabilities  include:

• Three-gun RF/DC physical vapor deposition.
• Machine configured to allow O₂ or N₂ reactive sputtering, dielectric thin films and co-deposition possible. 
• PVD Materials: Al, Al₂O₃, Ag, Au, Bi, Bi₂O₃, Cu, In, Ir, ITO (90%/10%), Nb, Ni, Ni/Cr (80%/20%), Mo, Pd, Pt, PTFE, Si, SiO₂, SiN, Ta, Ti, TiN, TiO2 W, Sb, ZnO, ZnO/AL₂O₃ (98%/2%) and ZTO.
• Other materials possible with user supplied target.

Contact: John Nogan